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      1. UFS-Based MCP (uMCP)

        UFS-based MCPOur UFS-based multichip packages (uMCPs) take advantage of the ultra-fast Universal Flash Storage (UFS) 2.1 controller to provide big performance and power savings in a small footprint for slim designs.

        Micron uMCPs, which combine LPDRAM, NAND and an onboard controller, use 40% less space than a two-chip mobile solution (PoP + discrete NAND), reducing memory footprints and enabling more agile system designs. Our MCPs use advanced packaging techniques to stack mobile DRAM on top of managed NAND, which allows for high-density, low-power storage solutions that fit into smaller smartphone designs.

        Learn more about UFS Technology